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EPI ºÐ¼®/¼ºÀå ±â¼ú |
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Chip °øÁ¤ °³¹ß ¹× ºÐ¼® ±â¼ú |
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LED PKG ¼³°è ±â¼ú |
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Set Interface 񃬣 |
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Cell °³¹ß/ÀÀ¿ë ±â¼ú |
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Camera
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±¤ÇÐ Lens ¼³°è |
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±¤ÇÐ Machanism ¼³°è |
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Image È¸Ã´È ±â¼ú |
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Analog ½ÅÈ£ ó¸® ±â¼ú |
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RF / IF ½ÅÈ£ ó¸® ±â¼ú |
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CAD ¹× ±â±¸ ¼³°è ±â¼ú |
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Digital ½ÅÈ£ ó¸® ±â¼ú |
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RF Mo/Demo(Tranceiver)¼³°è |
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S/W(M-COMÀÀ¿ë) |
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Up/Down Converting |
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ASIC¼³°è |
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| MOTOR |
Motor ÀÚ±âȸ·Î ¼³°è |
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Motor ±¸Á¶ ¼³°è |
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Motor ȸ·Î ¼³°è |
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| À§¼º DMB °³¹ß |
RF/Digital ¼³°è ¹× Simulation ±â¼ú |
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ȸ·Î ¹× Lay Out ¼³°è±â¼ú |
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°í¹Ðµµ ÆÐŰ¡ ±â¼ú |
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MMIC ¼³°è±â¼ú |
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Set Application 񃬣 |
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PFC Circuit Design 񃬣 |
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Thermal Analysis 񃬣 |
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Protection ¼³°è±â¼ú |
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Electrical ¼º´É ½ÃÇè±â¼ú |
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SMPS¼³°è±â¼ú |
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CVT topology Design & Anal. 񃬣 |
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S/W,±â±¸/ȸ·Î CAD¼³°è±â¼ú |
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°³¹ß±âȹ |
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Moduel |
RF ½ÅÈ£ 󸮱â¼ú |
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Bare Die ½ÇÀå±â¼ú/PKG |
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Software |
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DSP/ASIC ¼³°è ±â¼ú |
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RF º¹ÇÕ
Module |
RF ȸ·Î ¼³°è±â¼ú |
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RF ±¸Á¶ Çؼ® |
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Package °øÁ¤±â¼ú |
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Power(IPM°³¹ß
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Power Device & Drive I.C. °³¹ß±â¼ú |
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PKG & Process 񃬣 |
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System Application 񃬣 |
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motor drive񃬣 |
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| MCM |
°øÁ¤/±â¹Ý ±â¼ú |
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ASIC ÀÀ¿ë/¼³°è±â¼ú |
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¿øÀç·á ±â¼ú |
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¼ÒÇü RF¸ðµâ ¼³°è±â¼ú |
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3D ¼³°è |
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LT CC ¼³°è/°ø¹ý |
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Packaging |
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Bare ½ÇÀå/ Packaging±â¼ú |
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½Åȣó¸®/ °èÃøÁ¦¾î S/W |
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POL&COG&FOG °øÁ¤ |
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LCM Ass'y °øÁ¤ |
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